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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology

by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann


ISBN 13: 9781461354246

Format: Paperback (248 pages)
Publisher: Springer
Published: 23 Feb 2014

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Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems) by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif

Wafer Level 3-D ICs Process Technology (Integrated Circuits and Systems)

by Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif


ISBN 13: 9781441945624

Format: Paperback (376 pages)
Publisher: Springer
Published: 08 Dec 2010

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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology

by Christopher Lyle Borst,William N. Gill,Ronald J. Gutmann


ISBN 13: 9781402071935

Format: Illustrated (252 pages)
Publisher: Springer
Published: 30 Sep 2002

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New : $223.98  
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